Daim ntawv thov ntawm Electrothermal Tube Electroplating Copper Technology hauv Ultra Loj Nplai PLC Chips

Daim ntawv thov ntawm Electrothermal Tube Electroplating Copper Technology hauv Ultra Loj Nplai PLC Chips

Tam sim no, txoj kab dav ntawm cov khoom siv hluav taws xob hauv VLSI chips tau raug txo mus rau qib submicron, thiab raws li Moore Txoj Cai, yuav muaj kev txo qis ntxiv, uas yuav ua rau muaj kev tsis sib haum xeeb ntau dua ntawm RC ncua sij hawm thiab kev ntseeg ntawm electromigration ntawm interconnects. thiab kev ceev ntawm kev sib txuas ua ke. Feem ntau ntawm cov loj loj PLC chips siv txhuas raws li kev sib txuas, tab sis txhuas tsis zoo li tooj liab raws li kev coj ua thiab electromigration kuj. IBM thawj zaug hloov txhuas nrog tooj liab interconnect, thiab tom qab ntawd tooj liab interconnect tshuab tau dav siv nyob rau hauv feem ntau ntawm ultra loj PLC chips hauv Suav teb. Cov txheej tooj liab muaj qhov zoo conductivity, thiab cov electrodes ntawm lub flip nti FC cab kuj board yog electroplated nrog kub zaj duab xis los ntawm cov ntsiab lus protruding, uas txuas nrog txhuas electrodes ntawm lub nti. Qhov dav ntawm tooj liab nyob rau hauv lub nti tau nce los ntawm qhov qub {{0}}.25 μ M tau txo mus rau tam sim no 0.09-0.15 μ m. Raws li cov xwm txheej zoo li no, nws feem ntau ua tiav los ntawm Damascus txheej txheem thev naus laus zis ntawm electroplating tooj liab. Kev siv cov txheej txheem thev naus laus zis no tuaj yeem zam qhov tshwm sim ntawm cov kab nrib pleb, thiab ntxiv rau, nws tuaj yeem ua tiav qhov tsim ntawm cov kab thiab los ntawm qhov, nrog kev ceev ceev ceev thiab muaj zog ua haujlwm. Tam sim no, electroplating tooj liab thev naus laus zis tau dhau los ua txoj hauv kev tseem ceeb rau kev sib tshuam loj-scale PLC chips. Hauv kev ntim khoom ntawm cov khoom siv hluav taws xob, electroplating tooj liab thev naus laus zis kuj tau txais kev saib xyuas zoo. Tshwj xeeb tshaj yog rau qee qhov BGA ntim, cov tshuab no yuav tsum tau ua. Lub IC ntim cov cab kuj board txais yuav siv lead ua coated nyias zaj duab xis carrier board, uas yog ib tug high-density multi-layer printed board uas siv electroplating tooj liab txheej rau thaiv thiab sib tham sib txuas. Ntxiv rau nws daim ntawv thov hauv IC ntim, electroplating tooj liab thev naus laus zis kuj qhia txog nws txoj kev ua tau zoo thiab kev lag luam hauv cov txheej txheem tsim khoom ntawm PCBs.

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