Puas tseem muaj ntau tshaj hydrogen peroxide nyob rau hauv lub plating tov ntawm hluav taws xob cua sov raj

Puas tseem muaj ntau tshaj hydrogen peroxide nyob rau hauv lub plating tov ntawm hluav taws xob cua sov raj

Thaum siv cov pa roj carbon activated los kho cov tshuaj plating, yuav tsum tau them nyiaj rau qhov zoo ntawm cov pa roj carbon activated kom tsis txhob muaj impurities nkag mus rau hauv cov tshuaj plating. Yog tias cov pa roj carbon activated muaj zinc impurities, kev kho cov tshuaj nickel plating yuav ua rau cov nickel txheej tig dub los yog qhia streaks. Tsis tas li ntawd, thaum lim kom tshem tawm cov pa roj carbon activated los ntawm cov tshuaj plating, nws yog ib qho tsim nyog yuav tsum tau lim nws kom huv si kom tsis txhob muaj cov khoom me me ntawm cov pa roj carbon activated los ntawm kev nkag mus rau hauv cov tshuaj plating los ntawm cov khoom lim, ua rau ntxhib, tsaus, pinhole lossis txiv kab ntxwv tev zoo li coatings. tshwm sim thaum electroplating.

Qee zaum, txhawm rau tshem tawm cov organic impurities zoo dua, ua ntej siv cov pa roj carbon activated rau kev kho mob, oxidant (hydrogen peroxide lossis potassium permanganate) yog siv rau kev kho oxidation, uas yog hu ua kev kho mob ntawm oxidant thiab activated carbon. Txoj kev siv feem ntau yog hydrogen peroxide activated carbon kho. Thaum ua haujlwm no, nws yuav tsum tau tshem tawm cov khoom siv hydrogen peroxide ntau dhau ua ntej ntxiv cov pa roj carbon activated. Txwv tsis pub, hydrogen peroxide yog oxidant thiab activated carbon muaj reducibility, ua rau oxidation-txo cov tshuaj tiv thaiv (2H202 ntxiv rau C=2H2O ntxiv rau C02 ↑) ntawm ib leeg; Tsis tas li ntawd, vim yog qhov decomposition ntawm hydrogen peroxide rau hauv 02, nws yuav thaiv qhov pores zoo ntawm cov pa roj carbon activated nrog lub peev xwm adsorption, txo qhov muaj peev xwm adsorption ntawm activated carbon. Nws yog qhov zoo tshaj los xyuas seb puas tseem muaj ntau tshaj hydrogen peroxide hauv cov tshuaj plating ua ntej ntxiv cov pa roj carbon activated. Txoj kev tshuaj xyuas yog raws li nram no:

(1) Dissolve 5g ntawm KI hauv 100mL dej, ntxiv 5g ntawm soluble starch, thiab cua sov kom txog thaum yaj;

(2) Ncua ib qho kev daws teeb meem rau ntawm daim ntawv lim huv:

(3) Muab ob tee ntawm poov tshuaj iodide thiab cov hmoov txhuv nplej siab rau hauv daim ntawv lim uas siv cov tshuaj plating;

(4) Kev soj ntsuam cov xim: Yog tias xiav tshwm nyob rau hauv 5 vib nas this, nws qhia tias muaj ntau tshaj hydrogen peroxide (potassium iodide starch tov tsis ruaj khov, thiab nws yog qhov zoo tshaj los npaj thiab siv tam sim ntawd).

Cov txheej txheem adsorption ntawm cov pa roj carbon activated yog ceev ceev, thiab feem ntau cov organic impurities yog adsorbed nyob rau hauv ob peb feeb ntawm kev sib cuag thawj zaug. Yog li ntawd, ntev stirring thaum kho yog tsis tsim nyog, feem ntau tsuas yog nruam stirring rau li 30 feeb yog txaus.

Txoj kev ua kom cov pa roj carbon adsorption tuaj yeem siv rau yuav luag txhua qhov kev daws teeb meem tshwj tsis yog rau cov khoom muaj zog oxidizing uas siv tsis tau.

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