Qhov sib txawv me me nyob rau hauv cov khoom ntawm electroplated solder rau hluav taws xob cua sov raj tsis muaj kev cuam tshuam ntau rau lub melting point.
Tso lus
Qhov sib txawv me me nyob rau hauv cov khoom ntawm electroplated solder rau hluav taws xob cua sov raj tsis muaj kev cuam tshuam ntau rau lub melting point.
Txawm li cas los xij, daim duab binary theem ntawm Sn-Pb qhia tau hais tias qhov sib txawv me me hauv cov khoom sib xyaw ua ke tsis cuam tshuam rau lub melting point. Txawm li cas los xij, rau SnAg, qhov cuam tshuam tseem ceeb heev. Yog hais tias me ntsis nyiaj ntxiv rau eutectic muaj 3.5 feem pua nyiaj, lub melting point yuav zoo heev. Tsis tas li ntawd, FraunhoferIZM txoj kev tshawb fawb tseem qhia tau tias thaum cov ntsiab lus nyiaj yog 4 feem pua, kev loj hlob ntawm Ag3Sn cov hlau sib txuas sai dua, uas ua rau muaj kev puas tsuaj loj rau kev ntseeg siab ntawm kev sib txuas. Rau eutectic SnAg3.5 electroplating, kev tswj ntawm electroplating pas dej ua ke thiab alloy muaj pes tsawg leeg yog ib qho tseem ceeb heev. Cov txheej txheem electroplating ntawm ternary alloys yog qhov nyuaj dua thiab tsis txawm xav txog. Ntawm qhov tod tes, vim hais tias cov tooj liab plating txheej ntawm UBM yuav yog ib feem yaj nyob rau hauv SnAg, lub reflow soldering pob yuav ib txwm muaj SnAgCu alloy, thiab yuav raug cuam tshuam los ntawm reflow soldering kub.
Piv rau SnPb, kev siv tooj liab electroplating substrate yog siab dua thaum siv SnAg. Yog li ntawd, electroplating tooj liab muab yuav tsum muaj ib tug tej thickness. Yog tias peb xav txog tus nqi ua dua, tsis muaj qhov sib txawv tseem ceeb ntawm SnPb electroplating thiab SnAg electroplating (saib daim ntawv).
Nrhiav rau pem hauv ntej
Kev siv ntawm stencil luam ntawv thiab kev npaj ntawm electroplating wafer protrusions sawv cev rau cov xwm txheej tam sim no ntawm kev sib txuas ntawm cov tshuab tsis muaj hlau lead-dawb, thiab tseem qhia tau tias cov tshuab tsis muaj hlau lead yog ua tau. Txawm li cas los xij, lub sijhawm kawg rau xyoo 2006 tab tom los txog, thiab kev muab cov khoom tsis muaj hmoov txhuas tseem yog qhov teeb meem loj.
Solder paste luam ntawv yuav tsum tau siv cov qauv sib txawv me me, solder paste uas tuaj yeem hloov kho raws li qhov yuav tsum tau ua micro spacing, thiab optimized printing tsis. Cov chaw muab tshuaj txhuam cov khoom lag luam tau tsim ntau yam tsis muaj hmoov txhuas, suav nrog SnAg3.5, SnAgBixx, thiab SnCu0.9. Sn95.5Ag4Cu0.5 yog ib qho kev hloov pauv rau eutectic lead solder, thiab cov txheej txheem tawm los tau ua tiav dhau qhov kev sib piv nrog SnPb. Lub dov ceev, template stripping, thiab soj ntsuam tej yam kev mob yuav txiav txim qhov tawm los. Los ntawm kev siv tus qauv nrog lub thickness ntawm 80 hli, qhov siab protrusion ntawm ~ 110 hli tuaj yeem ua tiav.
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