Qhov sib txawv ntawm kev kho cua sov tom qab plating txheej txheem ntawm lub tshuab nqus tsev electroplating hluav taws xob cua sov raj

Qhov sib txawv ntawm kev kho cua sov tom qab plating txheej txheem ntawm lub tshuab nqus tsev electroplating hluav taws xob cua sov raj

Raws li kev soj ntsuam ntawm cov chaw tsim tshuaj lom neeg nickel electroplating, vim qhov sib txawv ntawm cov phosphorus (boron) muaj nyob rau hauv electroless npib tsib xee plating txheej thiab qhov sib txawv ntawm cov txheej txheem tom qab plating thaum tshav kub kub kev kho mob, lub cev thiab tshuaj lom neeg ntawm cov nickel plating. txheej, xws li hardness, corrosion kuj, hnav tsis kam, electromagnetic zog, thiab lwm yam. Cov yeeb yuj hloov tsis tshua muaj nyob rau hauv lwm hom plating. Yog li ntawd, daim ntawv thov kev lag luam thiab cov txheej txheem tsim ntawm electroless nickel plating muaj cov yam ntxwv ntawm ntau haiv neeg thiab tshwj xeeb.

Txoj kev thiab kev faib tawm ntawm lub tshuab nqus tsev electroplating hluav taws xob cua sov tube txheej

Kev tsim zaj duab xis nyob rau hauv lub tshuab nqus tsev muaj ntau qhov zoo: nws tuaj yeem txo qhov kev sib tsoo ntawm atoms thiab molecules ntawm cov khoom evaporated nrog cov molecules nyob rau hauv cov txheej txheem ya mus rau lub substrate, txo cov tshuaj tiv thaiv (xws li oxidation, thiab lwm yam) ntawm cov active molecules nyob rau hauv cov txheej txheem ntawm ya mus rau lub substrate. cov pa roj thiab cov khoom siv evaporation, thiab Txo cov roj molecules nkag mus rau hauv zaj duab xis los ua impurities thaum lub sij hawm tsim cov zaj duab xis, yog li txhim kho qhov ntom, purity, deposition npaum li cas thiab adhesion ntawm zaj duab xis txheej mus rau lub substrate. Feem ntau, lub tshuab nqus tsev vacuum xav kom lub siab nyob rau hauv cov zaj duab xis tsim chamber kom sib npaug los yog qis dua 10-2Pa. Rau lub sijhawm uas qhov kev ncua deb ntawm qhov chaw evaporation thiab substrate ntev thiab cov yeeb yaj kiab zoo yuav tsum tau siab, qhov siab yuav tsum qis dua.

Lub tshuab nqus tsev electroplating hluav taws xob cua sov raj muaj tshuaj lom neeg ruaj khov thiab zoo txheej adhesion

.High tshuaj stability, zoo txheej adhesion. Nyob rau hauv cov huab cua thiab lwm yam xov xwm, cov tshuaj stability ntawm cov electroless npib tsib xee txheej yog siab dua li ntawm electroplated npib tsib xee txheej. Nws muaj kev sib raug zoo nrog cov hlau li niaj zaus, tooj liab thiab lwm yam substrates, thiab lub zog sib txuas tsis qis dua qhov sib txuas ntawm cov electroplated npib tsib xee txheej thiab cov substrate.

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