Qhov cuam tshuam ntawm Electroplating Parameters thiab tshuaj Stirring ntawm hluav taws xob cua sov Tube

Qhov cuam tshuam ntawm Electroplating Parameters thiab tshuaj Stirring ntawm hluav taws xob cua sov Tube

Qhov sib sib zog nqus plating muaj peev xwm ntawm qhov los ntawm qhov yog siab dua 60 feem pua, qhia txog qhov zoo sib xws ntawm cov txheej thiab muaj zog sib sib zog nqus plating muaj peev xwm ntawm cov tshuaj plating. Qhov loj ntawm Cu2 ntxiv rau hauv cov tshuaj tooj liab sulfate yuav tsum tsis txhob siab dhau lossis qis dhau. Txawm hais tias Cu2 ntxiv qis dhau lawm, nws tuaj yeem txhim kho qhov sib sib zog nqus plating muaj peev xwm ntawm cov tshuaj plating, tab sis nws yog ib qho yooj yim los ua cov txheej kub kub hauv qhov chaw siab tam sim no. Yog tias Cu2 ntxiv yog siab dhau lawm, nws tseem yuav txo qhov sib sib zog nqus plating muaj peev xwm ntawm cov tshuaj plating; Qhov zoo concentration ntawm sulfuric acid kuj yuav tsum tau tswj kom tsim nyog. Yog hais tias sulfuric acid tsawg dhau, qhov conductivity thiab dispersion muaj peev xwm ntawm cov tshuaj plating tsis zoo, thiab yog tias sulfuric acid siab dhau lawm, qhov ci ntsa iab thiab smoothness ntawm tooj liab plating txheej yuav raug cuam tshuam [8]. Hauv cov ntsiab lus, txhawm rau txhim kho qhov sib sib zog nqus plating muaj peev xwm ntawm qhov me me txoj kab uas hla thiab siab thickness rau txoj kab uas hla piv PCB conductive qhov, nws yog ib qho tsim nyog los tswj cov concentration ntawm tooj liab sulfate thiab sulfuric acid.

3.2.2 Qhov cuam tshuam ntawm Electroplating Parameters thiab Solution Stirring

Kev sim tswj J κ Nws yog 1.5A / dm2 thiab t yog 80min. Cua nplawm, txau cov tshuaj plating sib npaug rau lub phaj nto, thiab cathode txav yog siv los txhim kho kev sib pauv ntawm cov tshuaj plating. Tom qab ua tiav ntawm lub qhov kab co plating, hlais lub qhov conducting thiab nplua Circuit Court cais los soj ntsuam lub qhov metallization nyhuv ntawm conducting qhov thiab zus tau tej cov zoo Circuit Court.

Cov nyhuv ntawm lub qhov metallization thiab nplua Circuit Court tsim los ntawm lub qhov tom qab lub qhov kab co plating yog qhov zoo, uas yog vim muaj kev tswj ntawm J κ A tus nqi ntawm 1.5A / dm2 tuaj yeem txo qhov sib txawv ntawm qhov nruab nrab ntawm lub qhov thiab lub qhov thiab lub phaj nto, ua rau kev faib ntawm cov txheej txheem ntau yam. Ib qho me me tam sim no muaj txiaj ntsig zoo rau kev txhim kho qhov sib sib zog nqus plating muaj peev xwm ntawm lub qhov los ntawm qhov. Lub sij hawm electroplating yog 80 feeb, uas yog raws li qhov kev txiav txim siab ntawm qhov xav tau tooj liab txheej thickness rau lub qhov metallization thiab nplua Circuit Court. Yog hais tias lub sij hawm luv luv, lub thickness ntawm lub qhov conductive thiab nplua Circuit Court txheej yog nyias nyias kom tau raws li cov txheej txheem yuav tsum tau; Yog hais tias lub sij hawm electroplating ntev dhau lawm, nws yog ib qho yooj yim ua rau lub thickness ntawm lub zoo Circuit Court kom dhau lub qhuav zaj duab xis thickness thiab ua rau cov zaj duab xis clamping. Tib lub sijhawm siv cua nplawm tuaj yeem ua kom nrawm nrawm ntawm cov tshuaj, txhim kho cov kev sib pauv hloov hauv lub qhov los ntawm kev txau cov tshuaj plating thaum uas tig mus rau lub phaj nto, thiab txav cov cathode tso cai rau cov tshuaj hla dhau ntawm lub qhov, ua kom nrawm nrawm thiab sib pauv. ceev ntawm cov plating tov nyob rau hauv lub los ntawm lub qhov, yog li txhim kho lub uniformity thiab sib sib zog nqus plating zog ntawm txheej.

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