Dab tsi yog qhov cuam tshuam ntawm hydrogen evolution los ntawm hluav taws xob cua sov raj ntawm electroplating?

Dab tsi yog qhov cuam tshuam ntawm hydrogen evolution los ntawm hluav taws xob cua sov raj ntawm electroplating?

9. Cov kev cai rau kev tsim cov pinholes yog dab tsi? Puas muaj qhov tsim ntawm pinholes vim qhov tsim ntawm npuas?

Teb: Lub cim ntawm pinholes feem ntau yog tshwm sim los ntawm kev tuav cov npuas ntawm qhov chaw ntawm plated, tab sis qhov tsim ntawm npuas tsis tas yuav ua rau lub pinhole tsim. Vim tias qhov tsim ntawm pinholes yuav tsum muaj ob yam xwm txheej: ua ntej, yuav tsum muaj npuas (tsuas yog hydrogen gas) generated; Qhov thib ob generated npuas yuav adsorb mus rau lub plated daim. Yog tias cov npuas tsim tsis tuaj yeem nyob ntawm qhov chaw ntawm cov plated, tsis muaj pinholes yuav raug tsim. Thaum lub sij hawm electrolysis txheej txheem, xws li cyanide tooj liab plating thiab chromium plating, ib tug loj tus naj npawb ntawm hydrogen npuas yog generated; Tab sis tom qab lawv tau tsim, lawv tag nrho cov dej ntws sai sai, ua rau nws nyuaj rau nyob rau ntawm qhov chaw plated, yog li pinholes tsis tshua tsim.

10. Qhov cuam tshuam ntawm hydrogen evolution ntawm electroplating yog dab tsi?

Teb: Hydrogen evolution yuav luag inevitable thaum lub sij hawm electroplating txheej txheem. Lub precipitated hydrogen nkag mus rau hauv cov txheej thiab substrate hlau, ua rau hydrogen embrittlement thiab cuam tshuam rau cov khoom siv ntawm cov khoom. Yog hais tias precipitated hydrogen nyob rau ntawm qhov chaw nyob rau hauv daim ntawv ntawm cov npuas, nws yuav ua rau pores thiab pits nyob rau hauv lub txheej. Txoj kev tshem tawm yog ntxiv oxidants, wetting agents, thiab tom qab plating hydrogen tshem tawm kev kho mob. Lub xub ntiag ntawm cov organic impurities muaj cov nyhuv adsorption ntawm hydrogen, ua rau nws nyuaj rau hydrogen npuas kom dim ntawm lub cathode nto, ua rau nws yooj yim rau pinholes thiab pitting.

11. Yuav ua li cas tshem tawm cov pinholes hauv txheej?

Teb: Lub cim ntawm pinholes yog ib qho teeb meem nyuaj heev. Yog tias pinholes raug tsim los ntawm kev ua haujlwm tsis zoo lossis kev daws teeb meem, nws tseem yog ib qho yooj yim los kho. Tsuas yog hloov cov kev khiav hauj lwm tej yam kev mob los yog kho cov tshuaj muaj pes tsawg leeg kom tau raws li qhov yuav tsum tau yuav daws tau qhov teeb meem. Yog tias muaj cov organic impurities nyob rau hauv cov tshuaj uas ua rau pinholes, lub hauv paus ua rau yuav tsum tau txheeb xyuas. Thaum tsis muaj cov organic impurities, ib txoj hauv kev yooj yim thiab siv tau yog ntxiv tus neeg sawv cev los tiv thaiv pinhole. Tus neeg sawv cev ntub dej (xws li sodium dodecyl sulfate, nrog rau ntau npaum li cas ntawm 0.01-0 05g / L) tuaj yeem muab ntxiv rau cov kua nplaum nickel plating. Hauv cov nickel plating tsis tu ncua, 0.1mL / L hydrogen peroxide tuaj yeem ntxiv tom qab ua haujlwm txhua hnub, thiab cov tshuaj tuaj yeem ua kom huv si tom qab ntxiv. Nyob rau hauv lub xub ntiag ntawm hydrogen peroxide (los yog lwm yam oxidants), cov tshuaj tiv thaiv ntawm H raug txo mus rau H ntawm cathode yog hloov los ntawm kev txo cov oxidants ntawm lub cathode, tshem tawm cov tiam ntawm hydrogen npuas thiab tsis txhob pinholes. Txawm li cas los xij, yog tias muaj ntau cov organic impurities hauv cov tshuaj plating, qhov ua tau zoo ntawm cov kev ntsuas no tseem yuav cuam tshuam, lossis txawm tias tsis muaj txiaj ntsig. Hauv qhov no, cov tshuaj plating yuav tsum tau kho nrog kev ua kom huv (ua ke kev kho mob ntawm hydrogen peroxide oxidation thiab activated carbon adsorption).

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