Muaj pes tsawg leeg thiab txheej txheem txheej txheem ntawm electroplating tov rau hluav taws xob cua sov raj

Muaj pes tsawg leeg thiab txheej txheem txheej txheem ntawm electroplating tov rau hluav taws xob cua sov raj

Cov tshuaj plating siv cov nickel plating electrolyte tsis tu ncua (sulfate low chloride nickel plating electrolyte), thiab cov txheej txheem thiab cov txheej txheem ntawm cov tshuaj plating yog raws li nram no:

NiSO4·6H2O, 25{17}}~300g/L; NiCl2 · 6H2O, 30 ~ 60g / L; H3BO3,35 ~ 40g / L; C12H26SO4Na (sodium dodecyl sulfate), 0.05-0.10g/L; PH tus nqi, 3-4; Kub, 45-60 degree ; Cathode tam sim no ceev, 2-3A/dm2; Cu hmoov, 8g / L; Kev sib xyaw ceev, 500r / min; Lub sijhawm electrolysis, 3-4 teev.

Ntawm lawv, NiSO4 · 6H2O thiab NiCl2 · 6H2O yog analytical ntshiab reagents, thaum C12H26SO4Na (sodium dodecyl sulfate) yog tshuaj dawb huv reagent. Lub zog ntawm txhua reagent yog raws li nram no: npib tsib xee sulfate yog lub ntsiab ntsev ntawm nickel plating electrolyte, muab nickel ions rau electrolysis; Cov chloride ions nyob rau hauv npib tsib xee chloride ua hauj lwm raws li anode activators los tiv thaiv anode passivation, thaum tseem muab nickel ions rau cov tshuaj, ua rau nws conductivity; H3BO3 yog ib qho tsis siv los kho tus nqi pH ntawm cov electrolyte; C12H26SO4Na (sodium dodecyl sulfate) yog tus neeg sawv cev ntub dej lossis tus pinhole tiv thaiv tus neeg sawv cev, uas tuaj yeem txhim kho qhov ua haujlwm ntub dej ntawm cov electrode ntawm electrode nto, ua rau nws nyuaj rau hydrogen gas rau adsorb ntawm electrode nto, yog li txo lossis tshem tawm qhov tshwm sim ntawm pinholes. .

1.2 Kev sim thiab cov cuab yeej siv

Lub tank electroplating yog 500mL beaker nrog cov hlau nplaum sib xyaw ua ke thiab kev teeb tsa sab nraud nrog DF? 101B collector hom qhov kub thiab txias sib nqus stirrer nrog lub phaj cathode ntawm 0.2mm × 58mm × 40mm analytical ntshiab tooj liab daim ntawv, nrog lub nraub qaum kaw nrog AB nplaum thiab cov anode ua los ntawm npib tsib xee thaiv. Thaum electroplating, txoj kev tam sim no yog siv, thiab txoj kev nplawm yog sib nqus stirring.

1.3 Kev Ntsuam Xyuas thiab Kev Ntsuas Cov Ntsiab Lus ntawm Cov Ntsiab Lus Copper Powder thiab Surface Morphology ntawm Composite Coatings

Scanning electron microscopy (SEM) siv cov khoom siv hluav taws xob thib ob thiab cov khoom siv hluav taws xob rov qab uas tsim los ntawm cov kab hluav taws xob thawj zaug uas ua rau lub ntsej muag ntawm cov ntaub ntawv rau duab thiab saib xyuas qhov chaw morphology ntawm micro cheeb tsam. Nws cov khoom siv, Lub Zog Dispersion Spectrometer (EDS), tuaj yeem kuaj xyuas cov tshuaj muaj pes tsawg leeg ntawm qee thaj tsam micro ntawm cov qauv.

Tev lub txheej ntawm lub phaj cathode, ntxuav, qhuav, thiab hnyav nws. Siv JSM-6360LV scanning electron microscope los soj ntsuam lub ntsej muag morphology ntawm cov txheej txheem sib xyaw thiab X-ray zog spectrum analyzer los ntsuas cov ntsiab lus ntawm tooj liab hmoov.

Siv Nyiv Shimadzu HMV? Hom 2 tag nrho tsis siv neeg microhardness tester (digital zaub) yog siv los ntsuas qhov microhardness ntawm hlau Ni Cu composite txheej qauv raws li GB / T4342-91, nrog ib tug load ntawm 200g thiab tuav lub sij hawm ntawm 30s. Txhua tus qauv raug kuaj ntawm 4 ntsiab lus.

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